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This site wiki.sematech.org states the following, "3D integration holds tremendous promise for future integrated circuits." We noticed that the website also said " The clear advantages of 3D integration include higher performance, lower power and increased functionality in a smaller form factor." It also stated " This potential is drawing considerable attention from a wide variety of companies across the semiconductor and MEMS industries. 3D integration holds tremendous promise for future chips. Despite its high potential, a lack of uniform standards and the limited maturity of key te." The header had 3D Interconnect TSV stress management through silicon vias as the highest ranking keyword.